NP-535BNP-535BNP-535B

Model No: NP-535B

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  • Super low dissipation factor at high frequency range
  • Rheology of resin controlled to benefit the lamination of the boards.
  • Flammability meets UL 94 V-0

 

INQUIRY
  • Super low dissipation factor at high frequency range
  • Rheology of resin controlled to benefit the lamination of the boards.
  • Flammability meets UL 94 V-0

Specifications

Characteristics

Unit

Conditioning

Typical Values

SPEC

Test Method

Permittivity

Process

-

10GHz/23℃

3.5

-

2.5.5.5

Design

-

3.52

Differential

phase length

Loss tangent

-

10GHz/23℃

0.0035

--

2.5.5.5

0.0037

SPDR

Volume resistivity

MΩ-cm

C-96/35/90

5x109

106 h

2.5.17

Surface resistivity

C-96/35/90

5 x107

104 h

2.5.17

Moisture absorption

%

D-24/23

<0.53mm

0.10

-

2.6.2.1

Flammability

-

C-48/23/50

94V0

94V0

UL94

Peel strength 1 oz

lb/in

288℃x10” solder floating

4.5~5.5

2.5 h

2.4.8

Heat resistance

SEC

288℃ solder dipping

300 h

10 h

2.4.13.1

Glass transition temp

DMA

210h

N/A

2.4.25

Coefficient of thermal expansion

Z-axis before Tg

Z-axis after Tg

 

ppm/℃

ppm/℃

 

TMA

TMA

 

30-50

200-250

N/A

2.4.24

Glass transition temp

DMA

> 210

N/A

2.4.25

Td (5% weight loss)

TGA, 10℃/min

390

325 h

2.4.24.6