NP-822NP-822NP-822

Model No: NP-822

Datasheet:Download

  • DK (10 GHz): 2.2
  • DF (10 GHz): 0.0009
  • Copper foil (oz): 1/0.035
  • Copper Thickness: 0.5/ 0.018
INQUIRY

FEATURES                                                                                        

  • Extremely Low Loss Tangent
  • Product Performance Uniformity
  • Excellent Dimensional Stability

APPLICATIONS:

  • Military Radar Feed Networks
  • Commercial Phased Array Networks
  • Low Loss Base Station Antennas
  • Missile Guidance Systems
  • Digital Radio Antennas
  • Filters, Couplers, LNAs

Specifications

Characteristics

Unit

Conditioning

Typical Values

SPEC

Test Method

Permittivity

Process

-

10GHz/23℃

2.20

-

2.5.5.5

Design

-

2.20

Differential

phase length

Loss Tangent

-

10GHz/23℃

0.0014

-

2.5.5.5

0.0013

SPDR

Thermal Coefficient of ɛr

ppm/°C

10 GHz -50 to 150 °C

80

 

IPC-TM-650 2.5.5.13

Volume resistivity

MΩ-cm

C-96/35/90

109

106 h

IPC-TM-650 2.5.17

Surface resistivity

C-96/35/90

108

104 h

IPC-TM-650 2.5.17

Arc resistance

SEC

D-48/50+D-0.5/23

180h

60 h

IPC-TM-650 2.5.1

Dielectric breakdown

KV

D-48/50

45h

20 h

IPC-TM-650 2.5.6

Td (5% weight loss)

TGA, 10℃/min

542.73

450 h

ASTM D3850

CTE (z) (50 - 260°C)

ppm/℃

TMA

357

N/A

IPC-TM-650 2.4.24

CTE (x,y) (50 - 260°C)

ppm/℃

TMA

20-30

N/A

IPC-TM-650 2.4.24

Thermal stress

SEC

288℃x10” solder dipping

300 h

10h

IPC-TM-650 2.4.13.1

Pressure cooker 2 hr

(2 atm 120℃)

SEC

288℃x10” solder dipping

300 h

N/A

-

Peel strength 1 oz

lb/in

288℃x10” solder floating

10-12

6h

IPC-TM-650 2.4.8

Moisture absorption

%

D-24/23

0.02

0.15↓

IPC-TM-650 2.6.2.1

Density (Specific Gravity)

g/cm3

 

2.1

2.05~2.15

ASTM D792

Flammability

-

C-48/23/50

V-0

V-0

UL94

Thermal Conductivity

W/mK

 

0.25

0.2h

ASTM F 433

Dimensional stability X-Y axis

%

E-0.5/170

0.01-0.03

0.05↓

IPC-TM-650 2.4.39

Passive Intermodulation

dBc

 

157

<-153

: IEC-62037