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Total Amount:
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FEATURES
APPLICATIONS:
Specifications
Characteristics |
Unit |
Conditioning |
Typical Values |
SPEC |
Test Method |
|
Permittivity |
Process |
- |
10GHz/23℃ |
2.60 |
- |
2.5.5.5 |
Design |
- |
2.60 |
Differential phase length |
|||
Loss Tangent |
- |
10GHz/23℃ |
0.0024 |
- |
2.5.5.5 |
|
0.0025 |
SPDR |
|||||
Thermal Coefficient of ɛr |
ppm/°C |
10 GHz -50 to 150 °C |
71 |
|
IPC-TM-650 2.5.5.13 |
|
Volume resistivity |
MΩ-cm |
C-96/35/90 |
109 |
106 h |
IPC-TM-650 2.5.17 |
|
Surface resistivity |
MΩ |
C-96/35/90 |
108 |
104 h |
IPC-TM-650 2.5.17 |
|
Arc resistance |
SEC |
D-48/50+D-0.5/23 |
180h |
60 h |
IPC-TM-650 2.5.1 |
|
Dielectric breakdown |
KV |
D-48/50 |
20h |
20 h |
IPC-TM-650 2.5.6 |
|
Td (5% weight loss) |
℃ |
TGA, 10℃/min |
540 |
450 h |
ASTM D3850 |
|
CTE (z) (50 - 260°C) |
ppm/℃ |
TMA |
185-215 |
N/A |
IPC-TM-650 2.4.24 |
|
CTE (x,y) (50 - 260°C) |
ppm/℃ |
TMA |
20-50 |
N/A |
IPC-TM-650 2.4.24 |
|
Thermal stress |
SEC |
288℃x10” solder dipping |
300 h |
10h |
IPC-TM-650 2.4.13.1 |
|
Pressure cooker 2 hr (2 atm 120℃) |
SEC |
288℃x10” solder dipping |
300 h |
N/A |
- |
|
Peel strength 1 oz |
lb/in |
288℃x10” solder floating |
11-13 |
6h |
IPC-TM-650 2.4.8 |
|
Moisture absorption |
% |
D-24/23 |
0.03 |
0.15↓ |
IPC-TM-650 2.6.2.1 |
|
Density (Specific Gravity) |
g/cm3 |
|
2.1 |
2.05~2.15 |
ASTM D792 |
|
Flammability |
- |
C-48/23/50 |
V-0 |
V-0 |
UL94 |
|
Thermal Conductivity |
W/mK |
|
0.37 |
0.2h |
ASTM F 433 |
|
Dimensional stability X-Y axis |
% |
E-0.5/170 |
0.01-0.03 |
0.05↓ |
IPC-TM-650 2.4.39 |
|
Passive Intermodulation |
dBc |
|
159 |
<-153 |
IEC-62037 |