NP-826

Characteristics

Unit

Conditioning

Typical Values

SPEC

Test Method

Permittivity

Process

-

10GHz/23℃

2.60

-

2.5.5.5

Design

-

2.60

Differential

phase length

Loss Tangent

-

10GHz/23℃

0.0024

-

2.5.5.5

0.0025

SPDR

Thermal Coefficient of ɛ_r

ppm/°C

10 GHz  -50 to 150 °C

71

IPC-TM-650 2.5.5.13

Volume resistivity

MΩ-cm

C-96/35/90

10⁹

10⁶ h

IPC-TM-650 2.5.17

Surface resistivity

MΩ

C-96/35/90

10⁸

10⁴ h

IPC-TM-650 2.5.17

Arc resistance

SEC

D-48/50+D-0.5/23

180h

60 h

IPC-TM-650 2.5.1

Dielectric breakdown

KV

D-48/50

20h

20 h

IPC-TM-650 2.5.6

Td (5% weight loss)

℃

TGA, 10℃/min

540

450 h

ASTM D3850

CTE (z) (50 - 260°C)

ppm/℃

TMA

185-215

N/A

IPC-TM-650 2.4.24

CTE (x,y) (50 - 260°C)

ppm/℃

TMA

20-50

N/A

IPC-TM-650 2.4.24

Thermal stress

SEC

288℃x10” solder dipping

300 h

10h

IPC-TM-650 2.4.13.1

Pressure cooker 2 hr

(2 atm 120℃)

SEC

288℃x10” solder dipping

300 h

N/A

-

Peel strength 1 oz

lb/in

288℃x10” solder floating

11-13

6h

IPC-TM-650 2.4.8

Moisture absorption

%

D-24/23

0.03

0.15↓

IPC-TM-650 2.6.2.1

Density (Specific Gravity)

g/cm³

2.1

2.05~2.15

ASTM D792

Flammability

-

C-48/23/50

V-0

V-0

UL94

Thermal Conductivity

W/mK

0.37

0.2h

ASTM F 433

Dimensional stability X-Y axis

%

E-0.5/170

0.01-0.03

0.05↓

IPC-TM-650 2.4.39

Passive Intermodulation

dBc

159

<-153

 IEC-62037